Citation: | SHI Fei, CHENG Xiao-min, ZHANG Tao-jie, DONG Xiang-huai. Numerical research of temperature field during resin transfer molding[J]. Applied Mathematics and Mechanics, 2016, 37(3): 256-265. doi: 10.3879/j.issn.1000-0887.2016.03.004 |
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