| Citation: | DING Jieying, XUE Feng, GOU Xiaofan. A Study on Interfacial Fracture Behaviors of Superconducting Thin Film/Substrate Structures on Taking the Account of Effects of Flux Flow[J]. Applied Mathematics and Mechanics, 2022, 43(6): 631-638. doi: 10.21656/1000-0887.420353
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The superconducting thin film is a kind of multilayer structure prepared by chemical coating. As a conductive functional structure material with excellent performance, its structural integrity is directly related to the current-carrying capacity. During the preparation of superconducting thin films, it is hard to avoid the interface cracks between the superconducting layer and the metal substrate. In this case, along with the current-carrying operation, the strength of the interface crack in an external magnetic field makes a key problem. Therefore, based on the theory of flux through the thin film and the linear elastic fracture, an analytical model was established for the strength of the interface crack between the superconducting film and the substrate. The effects of the viscous flux flow on the stress field and the energy release rate at the crack tip were obtained. The results show that, the higher the flux flow velocity is, the greater the stress and the energy release rate at the crack tip of the interface will be, which will lead to crack propagation along the interface. The work is helpful for the analysis of interface cracks mentioned above.
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