Numerical Study of Fluid Flow and Heat Transfer Characteristics in Metal-Foam Filled Microchannel Heat Sink

LI Yong-tong; XU Hui-jin; GONG Liang; ZHANG Ke-fang

doi:10.3879/j.issn.1000-0887.2014.03.007

Volume 35 Issue 3

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LI Yong-tong, XU Hui-jin, GONG Liang, ZHANG Ke-fang. Numerical Study of Fluid Flow and Heat Transfer Characteristics in Metal-Foam Filled Microchannel Heat Sink[J]. Applied Mathematics and Mechanics, 2014, 35(3): 287-294. doi: 10.3879/j.issn.1000-0887.2014.03.007

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Numerical Study of Fluid Flow and Heat Transfer Characteristics in Metal-Foam Filled Microchannel Heat Sink

doi: 10.3879/j.issn.1000-0887.2014.03.007

Department of Thermal Energy & Power Engineering, College of Pipeline and Civil Engineering, China University of Petroleum, Qingdao, Shandong 266580, P.R.China

Funds: The National Natural Science Foundation of China（51206187）

Received Date: 2013-11-01
Rev Recd Date: 2014-01-20
Publish Date: 2014-03-15

Abstract

Abstract

A novel structure of metal-foam filled microchannel heat sink was proposed for electronics cooling applications. Effects of the main parameters, such as porosity, pore density, metal foam materials (copper, nickel and aluminum) and coolants (water, ethylene glycol and nanofluid), were numerically studied to predict the pressure drop and heat transfer performance of laminar flow in the heat sink. The results show that the thermal performance of the microchannel heat sink is enhanced over twice after filling-in of metal foam, and it is also positive for the heat transfer efficiency to employ nanofluid as coolant. The results also show that the microchannel heat sink filled with metal foam is well qualified for cooling chips with heat flux of 200 W/cm^2, which means that it has great potential for thermal management of electronics devices with high power density.
- metal-foam,
- microchannel heat sink,
- thermal management of electronic device,
- nanofluid,
- flow and heat transfer

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References(17)

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