Volume 46 Issue 12
Dec.  2025
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MA Weiwei, WANG Yuxing, SHEN Huoming, LIU Juan. Investigation of the Sphere-Plane Contact Problem Under Micro-Scale Effects[J]. Applied Mathematics and Mechanics, 2025, 46(12): 1550-1559. doi: 10.21656/1000-0887.450260
Citation: MA Weiwei, WANG Yuxing, SHEN Huoming, LIU Juan. Investigation of the Sphere-Plane Contact Problem Under Micro-Scale Effects[J]. Applied Mathematics and Mechanics, 2025, 46(12): 1550-1559. doi: 10.21656/1000-0887.450260

Investigation of the Sphere-Plane Contact Problem Under Micro-Scale Effects

doi: 10.21656/1000-0887.450260
Funds:

The National Science Foundation of China(12402113)

  • Received Date: 2024-09-25
  • Rev Recd Date: 2024-12-06
  • Available Online: 2025-12-31
  • Based on the surface elasticity and couple stress theories, a 3D contact problem between a rigid spherical indenter and an elastic half-space at the micro and nano scale was studied. The size effects of materials were described with the characteristic material lengths of the surface and the material. Through combination of the surface elasticity theory and the couple stress theory, the frequency response function in the elastic half-space under normal loading was derived. Then, with the conjugate gradient method and the fast Fourier transform, a 3D semi-analytical contact model was established. The proposed model was then used to analyze the effects of surface residual stress, surface material constants, and the characteristic material lengths on the contact pressure, stress, and displacement on the contact surface. The results show that, compared with the classical contact solution, the contact pressure at the contact edge of the surface decrease sharply under the size effects. Additionally, the normal stress on the surface remains continuous and without abrupt changes at the contact edge, while the tangential stress is non-zero, and the normal displacement of the surface decreases. Furthermore, as the characteristic material length of the material increases, the direction of the tangential stress on the surface will reverse.
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