Numerical Analysis on Debonding of Crystal-Binder Interface in TATB-Based Polymer-Bonded Explosive Caused by Heating and Cooling Processes

FAN Zhengjie; LIU Zhanfang

doi:10.21656/1000-0887.410062

Volume 41 Issue 9

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FAN Zhengjie, LIU Zhanfang. Numerical Analysis on Debonding of Crystal-Binder Interface in TATB-Based Polymer-Bonded Explosive Caused by Heating and Cooling Processes[J]. Applied Mathematics and Mechanics, 2020, 41(9): 956-973. doi: 10.21656/1000-0887.410062

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Numerical Analysis on Debonding of Crystal-Binder Interface in TATB-Based Polymer-Bonded Explosive Caused by Heating and Cooling Processes

doi: 10.21656/1000-0887.410062

FAN Zhengjie¹,
LIU Zhanfang^2,3

¹College of Aerospace Engineering, Chongqing University, Chongqing 400044, P.R.China;²State Key Laboratory of Coal Mine Disaster Dynamics and Control,Chongqing University, Chongqing 400044, P.R.China;

Funds: The Joint Fund of the National Natural Science Foundation of China and the China Academy of Engineering Physics(U1830115)

Received Date: 2019-12-11
Rev Recd Date: 2020-01-11
Publish Date: 2020-09-01

Abstract

Abstract

Polymer-bonded explosive (PBX) is a kind of heterogeneous material composed of energetic crystals and binder as a microstructure. The mechanical properties of crystals, binder layers and the crystal-binder interface under thermomechanical environment are the main factors on PBX damages. Based on the Voronoi theory and the Monte Carlo gradation thought, a 2D geometric model for PBX was established with 5 different crystal volume fractions. With the influence of temperature change on the thermodynamic properties of the crystals and binder, a bilinear cohesive contact relationship model was introduced to describe the mechanical properties of the crystal-binder interface, and the damage mechanism of PBX interface during the heating and cooling processes was analyzed numerically. The results show that, the interface tangential stress increases with the temperature, which leads to debonding of the interface. The debonding of the crystal-binder interface mainly depends on the interface normal stress at a decreased temperature. Compared with the heating process, the cooling process makes interface debonding easier to occur, in agreement with experimental observations. With the increase of the crystal volume fraction, the residual stiffness of interface after the cooling process goes higher, which means that the increase of the PBX crystal volume fraction is helpful to control interfacial debonding. With the same crystal volume fraction, the more uniform the crystal sizes are, the smaller the interfacial damage degree will be.
- polymer-bonded explosive,
- Voronoi theory,
- crystal-binder interface,
- crystal volume fraction

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References(24)

References

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